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  Datasheet File OCR Text:
 Standard Power MOSFET
P-Channel Enhancement Mode Avalanche Rated
IXTH 50P085
VDSS ID25
RDS(on)
= -85 V = -50 A = 55 m
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR PD TJ TJM Tstg TL Md Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C TC = 25C, pulse width limited by TJ TC = 25C TC = 25C TC = 25C
Maximum Ratings -85 -85 20 30 -50 -200 -50 30 300 -55 ... +150 150 -55 ... +150 V V V V A A A mJ W C C C C
TO-247 AD
D (TAB)
G = Gate, S = Source,
D = Drain, TAB = Drain
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Mounting torque
300
Features * International standard package JEDEC TO-247 AD * Low RDS (on) HDMOSTM process
1.13/10 Nm/lb.in. 6 g
* * *
Rugged polysilicon gate cell structure Unclamped Inductive Switching (UIS) rated Low package inductance (<5 nH) - easy to drive and to protect
Symbol
Test Conditions
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. -85 -3.0 -5.0 100 TJ = 25C TJ = 125C -25 -1 55 V V nA A mA m
VDSS VGS(th) IGSS IDSS RDS(on)
VGS = 0 V, ID = -250 A V DS = VGS, ID = -250 A V GS = 20 VDC, VDS = 0 V DS = 0.8 * VDSS V GS = 0 V VGS = -10 V, ID = 0.5 * ID25
* * * *
Applications High side switching Push-pull amplifiers DC choppers Automatic test equipment
Advantages Easy to mount with 1 screw (isolated mounting screw hole) * Space savings
* *
High power density
(c) 2004 IXYS All rights reserved
DS99140A(10/04)
IXTH 50P085
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 8 16 4200 VGS = 0 V, VDS = -25 V, f = 1 MHz 1720 750 46 VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 RG = 4.7 (External) 39 86 38 150 VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 36 70 0.42 0.25 S pF pF pF ns ns ns ns nC nC nC K/W K/W
Terminals: 1 - Gate 3 - Source 2 - Drain Tab - Drain
1 2 3
TO-247 AD Outline
gfs Ciss Coss C rss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCS
VDS = -10 V; ID = ID25, pulse test
Dim.
Source-Drain Diode Symbol IS ISM VSD t rr Test Conditions VGS = 0
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. -25 -200 -3 180 A A V ns
Millimeter Min. Max. A 4.7 5.3 2.2 2.54 A1 A2 2.2 2.6 b 1.0 1.4 b1 1.65 2.13 b2 2.87 3.12 C .4 .8 D 20.80 21.46 E 15.75 16.26 e 5.20 5.72 L 19.81 20.32 L1 4.50 P 3.55 3.65 Q 5.89 6.40 R 4.32 5.49 S 6.15 BSC
Inches Min. Max. .185 .209 .087 .102 .059 .098 .040 .055 .065 .084 .113 .123 .016 .031 .819 .845 .610 .640 0.205 0.225 .780 .800 .177 .140 .144 0.232 0.252 .170 .216 242 BSC
Repetitive; pulse width limited by TJM IF = IS, VGS = 0 V, Pulse test, t 300 s, duty cycle d 2 % IF = IS, di/dt = 100 A/s, VR = -50 V
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or moreof the following U.S. patents: 4,835,592 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,381,025 5,486,715 6,162,665 6,259,123 B1 6,306,728 B1 6,404,065 B1 6,534,343 6,583,505 6,683,344 6,710,405B2 6,710,463 6,727,585 6,759,692
IXTH 50P085
Fig. 1. Output Characte ris tics @ 25 Deg. C
-50 -45 -40 VGS = -10V -9V -8V -140 -120 -100 -80 -60 -40 -20 -5V 0 0 -0.5 -1 -1.5 -2 -2.5 0 -2 -4 -6 -8 -7V -6V -5V -10 -12 -14 -16 -18 -20 -9V
Fig. 2. Exte nded Output Characteristics @ 25 de g. C
VGS = -10V
I D - Amperes
-30 -25 -20 -15 -10 -5 0 -6V -7V
I D - Amperes
-35
-8V
V D S - Volts Fig. 3. Output Characte ris tics @ 125 Deg. C
-50 -45 -40 VGS = -10V -9V 2 1.8 VGS = -10V
V D S - Volts Fig. 4. RDS(on) Norm alize d to ID25 Value vs. Junction Te m pe rature
R D S (on) - Normalized
-8V
I D - Amperes
-35 -30 -25 -20 -15 -10 -5 0 0 -1 -2 -3 -4 -5 -5V -6V -7V
1.6 1.4 1.2 1 0.8 0.6 -50 -25 0 25 50 75 100 125 150 I D = -50A I D = -25A
V D S - Volts Fig. 5. RDS(on) Norm alize d to ID25 Value vs . ID
2.4 2.2 VGS = -10V -55 -50 -45
TJ - Degrees Centigrade Fig. 6. Drain Curre nt vs. Cas e Te m pe rature
R D S (on) - Normalized
2
-40
I D - Amperes
-100 -125
1.8 1.6 1.4 1.2 1 0.8 0 -25 -50
TJ = 125C
-35 -30 -25 -20 -15
TJ = 25C
-10 -5 0
-75
-50
-25
0
25
50
75
100
125
150
I D - Amperes
(c) 2004 IXYS All rights reserved
TC - Degrees Centigrade
IXTH 50P085
Fig. 7. Input Adm ittance
-150 40 35 TJ = -40C 25C 125C TJ = -40C 25C 125C
Fig. 8. Transconductance
-125 -100
I D - Amperes
g f s - Siemens
-9 -1 0 -1 1
30 25 20 15 10
-75 -50
-25 0 -4 -5 -6 -7 -8
5 0 0 -25 -50 -75 -100 -125 -150
V G S - Volts Fig. 9. Source Current vs. Source-ToDrain Voltage
-150 -10 -9 -125 -100 -8 -7 VDS = -50V I D = -25A I G = -1mA
I D - Amperes Fig. 10. Gate Charge
I S - Amperes
VG S - Volts
TJ = 25C -3 -3.5 -4
-6 -5 -4 -3 -2 -1
-75 TJ = 125C
-50 -25
0 -0.5 -1 -1.5 -2 -2.5
0 0 20 40 60 80 100 120 140
V S D - Volts Fig. 11. Capacitance
6000 f = 1MHz 5000 1.00
Q G - nanoCoulombs Fig. 12. Maxim um Transient Therm al Resistance
Capacitance - pF
4000
C iss
R (th) J C - (C/W)
3000 C oss
0.10
2000 1000 C rss 0 0 -5 -10 -15
0.01 -25 -30 -35 -40 1 10 100 1000
-20
V D S - Volts
IXYS reserves the right to change limits, test conditions, and dimensions.
Pulse Width - milliseconds


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